| SERIAL |
ITEM |
TECHNICAL DATA |
| 1 |
Board Type |
Rigid Board, RF |
| 2 |
Material |
FR4 Standard TG155 °C, ROGERS,
TEFLON
|
| 3 |
Layers |
1-8 Layers Pcb Prototype
|
| 4 |
Max Board Size |
400mm * 600mm |
| 5 |
Board Thickness |
0.25mm - 3.20mm |
| 6 |
Min line Width |
0.15 mm |
| 7 |
Min Space Width |
0.1 mm |
| 8 |
Min Hole Size |
0.2 mm |
| 9 |
Min Annular Ring |
0.15mm |
| 10 |
Copper Thickness |
35um - 70um |
| 11 |
Inner Layer Copper Thickness |
18um ,35um |
| 12 |
Solder Mask Color |
Green, Black, White, Blue, Red, Yellow |
| 13 |
Silkscreen (Legend) Color |
White, Black, Yellow |
| 14 |
Surface Finishing |
HASL - Hot Air Solder Leveling
ENIG - Electro less Nickel / Immersion
Gold
|
| 15 |
Electrical Test |
Yes |
| 16 |
AOI (Automatic Optical Inspection) Test
|
Yes
|
| 17 |
Min Core Thickness For Multilayer
|
0.25 mm |
| 18 |
FR4 TG 140 °C Prepreg Specification For Multi layer
|
106 RC 71.5% 57um
1080 RC 62% 76um
2113 RC 56% 100um
2116 RC 53% 130um
7628 RC 43% 200um
|